High Power Bar Tester

Features

• Fully automatic process includes measurement, sorting, loading & unloading

• Support 25~85 °C testing

• Room / High temp. dual testing platform

• Stable temperature control

• LIV curve measurement

• OSA applicable

• Use the CCD camera (maximum 5 sets) to confirm the Die and monitor the motion.

• Use the reference Die to check for system abnormalities more easily

Data Communication & High Current

EML + SOA Chip Tester

Features

• Fully automatic process includes measurement, sorting, loading & unloading

• Support 25~95 °C testing

• Room / High temp. dual testing platform

• Stable temperature control

• LIV curve measurement

• OSA applicable

• Use the CCD camera to confirm the Die and monitor the motion

• Use the reference Die to check for system abnormalities more easily

High-Speed Data Communication

COC Tester

Features

• Fully automatic process includes measurement, sorting, loading & unloading

• Support 25~90 °C testing Room / High temp. dual testing platform

• Stable temperature control

• LIV curve measurement

• OSA applicable

• Use the CCD camera to confirm the COC and monitor the motion

• Use the reference COC to check for system abnormalities more easily

High Temperature & Extreme Environment

Burn-In System

Features

• Aging screening of COC wafers of DFB, EML, and EML-SOA types

• Support 40~125 °C testing

• Each drawer can be independently temperature-controlled and driven with current, enabling multi-temperature zones, multi-product, and multi-process aging

• Stable temperature control.

• Enhanced drive power supply, flexibly supports DFB/EML/Tunable COC

• A single-layer aging chamber can be used independently, or its aging capacity can be increased through rack assembly, offering flexible configuration options

• Supports online monitoring of output power or LIV testing

• Drive current up to 500 mA, supporting aging of high-power laser COC

Automotive & Industrial Applications

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